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ICs for Communications
ISDN High Voltage Power Controller IHPC PEB 2026 Version 1.1
Data Sheet 09.99
DS 2
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PEB 2026 Revision History: Previous Version: Page (in previous Version) Page (in current Version) 3-2 3-3 3-3 16 17 7-1 7-4 Current Version: 09.99 preliminary Data Sheet 02.96 Subjects (major changes since last revision)
Information added about thermal protection and life time Information added about parasitic diodes Extra paragraphfor subject "IBAT current peak" Some values for absolute maximum ratings are extended/adapted. The static thermal resistances are updated. The last two paragraphs on this page, explaning the reason for the different packages are additional.
For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com
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ABM(R) , AOP(R) , ARCOFI(R), ARCOFI (R)-BA, ARCOFI(R)-SP, DigiTape(R) , EPIC(R)-1, EPIC(R)-S, ELIC(R) , FALC(R)54, FALC(R)56, FALC(R) -E1, FALC(R) -LH, IDEC(R), IOM (R), IOM (R)-1, IOM (R)-2, IPAT(R)-2, ISAC(R) -P, ISAC(R) -S, ISAC(R) -S TE, ISAC(R) -P TE, ITAC (R), IWE(R), MUSAC(R) -A, OCTAT(R)-P, QUAT(R)-S, SICAT(R), SICOFI(R), SICOFI (R)-2, SICOFI(R)-4, SICOFI(R) -4C, SLICOFI(R) are registered trademarks of Infineon Technologies AG. ACETM, ASMTM, ASPTM, POTSWIRETM, QuadFALCTM, SCOUTTM are trademarks of Infineon Technologies AG. Edition 09.99 Published by Infineon Technologies AG, TR, Balanstrae 73, 81541 Munchen (c) Infineon Technologies AG 1999. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems2 with the express written approval of the Infineon Technologies AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
PEB 2026 PEF 2026
Table of Contents 1 1.1 2 2.1 2.2 3 4 5 6 7 8 Page
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Designing the External Components . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 Application Note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-1 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-1
Data Sheet
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List of Figures Figure 2-1 Figure 2-2 Figure 3-1 Figure 5-1 Figure 5-2 Figure 5-3 Figure 5-4 Figure 5-5 Figure 5-6 Figure 5-7 Figure Figure Figure Figure Figure Figure Figure Figure 6-1 7-1 7-2 7-3 7-4 7-5 7-6 7-7 Page
Pin Configuration P-DSO-20-6 (top view) . . . . . . . . . . . . . . . . . . . . . . 2-1 Pin Configuration P-DSO-20-10 (top view) . . . . . . . . . . . . . . . . . . . . . 2-1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Current limit ILimit,ON as a function of RREF (typical values) . . . . . . . . . . 5-1 Power Supply Current IBAT as a function of RREF (typical values) . . . . 5-2 Power Supply Current IDD as a function of RREF (typical values) . . . . 5-2 Corner frequency of high-pass filter as a function of CHP (typical values) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 Time constant of high-pass filter as a function of CHP (typical values) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 Delay time of the low-pass filter for the status output signal (typical values) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 Delay time of the low-pass filter for the status output signal (typical values) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 Power Dissipation and Reference Voltage Output. . . . . . . . . . . . . . . . 7-6 Maximal Line Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-7 Resistances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-7 Line Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-8 Line Status under Superimposed Longitudinal Current . . . . . . . . . . . . 7-8 Timing-Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-9 Lightning Voltage Influence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-10
Data Sheet
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List of Tables Table 2-1 Table 2-2 Table 7-1 Table 7-2 Table 7-3 Table 7-4 Table 7-5 Table 7-6 Page 2-2 2-2 7-1 7-2 7-3 7-3 7-4 7-6
Pin Definitions and Functions P-DSO-20-6 . . . . . . . . . . . . . . . . . . . . Pin Definitions and Functions P-DSO-20-10 . . . . . . . . . . . . . . . . . . . Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power-Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DC-Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indication of Current Limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Timing-Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Sheet
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Overview
1
Overview
The IHPC is an integrated power controller especially designed for feeding two-wire ISDN-transmission lines. One line can be powered by one IHPC. An external resistor defines the value of the current-limit for the line. Powering can be switched on or off by the logic inputs "PFEN" and "PFENQ". With a logic low at the "APFI" output the IHPC signals that current-limiting is active; this signal is low-pass filtered. An external capacitor defines the corner frequency of this low-pass filter and the resulting delay time respectively. A second external capacitor is needed to make sure that longitudinal disturbances (AC) will not produce a current limiting effect. Line current-limiting and reducing this limiting level in case of overtemperature guards the IHPC against overloads.
Data Sheet
1-1
09.99
ISDN High Voltage Power Controller IHPC
PEB 2026
Version 1.1
CMOS
1.1
* * * *
Features
Battery voltage up to 130 V Supplies power for one transmission line Current limiting and chip temperature control Limiting current can be programmed by an external resistor * Automatically reduced feeding current in case of overtemperature * Reliable 170 V Smart Power Technology (SPT 170) * Small P-DSO-20 package
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P-DSO-20-6
P-DSO-20-10
Type PEB 2026
Package P-DSO-20-6 P-DSO-20-10
Data Sheet
1-2
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Pin Description
2
2.1
Pin Description
Pin Configuration
P-DSO-20-6
Figure 2-1
*P-DSO-20-10
Pin Configuration P-DSO-20-6 (top view) P-DSO-20-10
Figure 2-2
Pin Configuration P-DSO-20-10 (top view)
Data Sheet
2-1
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PEB 2026 PEF 2026
Pin Description
2.2
*
Pin Definitions and Functions
Pin Definitions and Functions P-DSO-20-6 Symbol Type Description
Table 2-1 Pin 4-7, 14-17 20 1 3 9 19 18 2 11 12 10 8 13
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VBAT
GNDB
Supply Negative battery supply voltage (- 100 V), referred to GNDB Supply Battery ground: RB and RA refer to this pin Supply Positive supply voltage (+ 5 V), referred to GNDD Supply Digital ground: VDD, REF, CP, CN, CTP, PFEN, PFENQ and APFI refer to this pin O O I O O O I I O Reference output, connected to GNDD via a resistor Positive pole of the external capacitor CHP Negative pole of the external capacitor CHP Positive pole of the external capacitor CTP Output for powering line b (tip), current sensing High voltage output for powering line a (ring), current limiting/switching Logic high on this pin switches on the current feeding Logic low on this pin switches on the current feeding Logic low on this pin signals active current-limiting
VDD
GNDD REF CP CN CTP RB RA PFEN PFENQ APFI
Table 2-2 Pin 1,10, 11,20 4 5 7 15 3 2 6 17
Pin Definitions and Functions P-DSO-20-10 Description Supply Negative battery supply voltage (- 100 V), referred to GNDB Supply Battery ground: RB and RA refer to this pin Supply Positive supply voltage (+ 5 V), referred to GNDD Supply Digital ground: VDD, REF, CP, CN, CTP, PFEN, PFENQ and APFI refer to this pin O O I O O Reference output, connected to GNDD via a resistor Positive pole of the external capacitor CHP Negative pole of the external capacitor CHP Positive pole of the external capacitor CTP Output for powering line b (tip), current sensing
Symbol Type
VBAT
GNDB
VDD
GNDD REF CP CN CTP RB
Data Sheet
2-2
09.99
PEB 2026 PEF 2026
Pin Description Table 2-2 Pin 18 16 14 19
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Pin Definitions and Functions P-DSO-20-10 (cont'd) Description High voltage output for powering line a (ring), current limiting/switching Logic high on this pin switches on the current feeding Logic low on this pin switches on the current feeding Logic low on this pin signals active current-limiting O I I O
Symbol Type RA PFEN PFENQ APFI
Data Sheet
2-3
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PEB 2026 PEF 2026
Functional Description
3
*
Functional Description
Figure 3-1
Block Diagram
The current flowing from GNDB to RB is measured. A down scaled image of this current is filtered by a high-pass filter with a corner frequency fCHP of approximately 3 Hz (see
Data Sheet
3-1
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PEB 2026 PEF 2026
Functional Description Figure 5-4). This filter needs the external capacitor CHP. This "AC"-current is subtracted from the reference-current generated in the bandgap. The value of the reference-current is defined by the external resistor RREF. In case of overtemperature the thermal protection TH-PROT sinks a current, so that the current ILimit is reduced. So in case of high power dissipation on chip the junction temperature is limited to about 165 C. This function is a protection against instant damages due to overload at the outputs. Continuous high temperatures during operation, however, will reduce the life time of the IHPC. A maximum junction temperature of 150C shall not be exceeded (See section 7, "Electrical Characteristics") Measures have to be taken to switch off the IHPC in case of a short-circuit. E.g. if pin APFI indicates active current-limiting, the IHPC should be deactivated after 1.5 sec using pin PFEN or PFENQ. A consecutive power-up attempt shall give enough time to the IHPC to cool down again (e.g. 30 sec). The current ILimit is reflected to the output current ILine flowing from RA to VBAT using the operational-amplifier OP, the transistor TL and two resistors (4 , 4 k).
ILine,max (t) = 1000 x ILimit (t) = 1000 x (IREF - ITH-PROT (t) - IAC (t))
In case of "no current-limiting" the output voltage of the operational-amplifier OP is equal to the positive OP-supply voltage. The transistor TL is "switched on". If the output current ILine rises to ILine,max the current-mirror becomes active and keeps the output current at this level. The voltage level at the gate of transistor TL shows the state of the current-limiter (current-limiting active or not). This state-signal is filtered by a low-pass filter and generates the logic output APFI. The external capacitor CTP of this low-pass filter defines the corner frequency and the resulting delay times tLIMON (Spec.-No.: 17) and tLIMOFF (Spec.No.: 18) respectively. Summarized, the current sensor I-SENS and the high-pass filter prevent, that a longitudinal disturbance in the frequency range from about (5*fCHP) to about 100kHz result in a current limitation. This applies if the maximum amplitude of the longitudinal current is lower than about half of the current limit (Spec.-No.: 3) defined by the external resistor RREF, see also Spec.-No.: 15 and 16. There is also another effect from the current sensing and high-pass filtering, which can be seen when changing from status LIMOFF to LIMON. This can occur by switching power on to the line (loading the line capacitor) or in case of short-circuiting the line. The resulting current transient starts at half of ILine,max and increases (capacitor loading function) to ILine,max with a time constant tCHP also defined by the value of CHP.
Data Sheet
3-2
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Functional Description The diodes connected to GNDB and RB protect the IHPC against lightning and overvoltages (see Absolute Maximum Ratings). The diode Dp is the parasitic bulkdrain-diode of the DMOS-transistor TL. Because of technology reasons (p"-substrate, junction isolation) there are also parasitic diodes from pin VBAT to all other pins.
IBAT current peak:
When line feeding is switched on (transistor TL is on) and a short circuit occurs between pins RA and GNDB (or GNDD) then it needs a certain time to unload the gate-sourcecapacitance of TL and to limit the current to the defined maximum value. In the meantime a current peak IBAT on the supply voltage VBAT can be seen. An overvoltage protection circuit for pin RA, for example can produce such a short circuit between pins RA and GNDB. In the IHPC a fast bipolar npn-transistor limits such current peaks. With V BAT =100 V, the resulting IBAT current transient has the profile of one triangular pulse with a peak value of about 1.5A and a time duration (50% to 50%) of about 130nsec.
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Data Sheet
3-3
09.99
PEB 2026 PEF 2026
Operating Modes
4
Operating Modes
Status PFEN "VIL" LIMON, limiter is active LIMOFF, limiter isn't active "VIH" "VIH" PFENQ APFI "VOL" "VOL" "VOH" Dont care "VOL" "VIL" "VIL"
Operating Mode OFF, powering off OFF, powering off ON, powering on ON, powering on
Dont care "VIH"
The logic input pins PFEN and PFENQ are connected to GNDD by integrated current sources. If these pins are not connected externally the logic level is "VIL".
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Data Sheet
4-1
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PEB 2026 PEF 2026
Designing the External Components
5
Designing the External Components
Resistor RREF: The value of this resistor defines the current limit ILimit,ON (Spec.-No.: 3) and it will also effect power supply currents IBAT (Spec.-No.: 2) and IDD (Spec.-No.: 1). For typical values of ILimit,ON , IBAT and IDD as a function of RREF see the following diagrams.
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110 100 90 ILimit,ON [mA] 80 70 60 50 40 30 20 10 15 18 22 27 RREF [k] 33 36 39 47
Figure 5-1
Current limit ILimit,ON as a function of RREF (typical values)
Data Sheet
5-1
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PEB 2026 PEF 2026
Designing the External Components
*
0,22 0,2 0,18 IBAT [mA] 0,16 0,14 0,12 0,1 0,08 10 15 18 22 27 RREF [k] 33 36 39 47
Figure 5-2
Power Supply Current IBAT as a function of RREF (typical values)
*
0,9 0,85 0,8 0,75 IDD [mA] 0,7 0,65 0,6 0,55 0,5 0,45 0,4 10 15 18 22 27 RREF [k] 33 36 39 47
Figure 5-3
Power Supply Current IDD as a function of RREF (typical values)
Data Sheet
5-2
09.99
PEB 2026 PEF 2026
Designing the External Components Capacitor CHP: The value of this capacitor defines the corner frequency fCHP of the high-pass filter and the time constant tCHP of the current transient described at the last but one paragraph of chapter 2. The following diagrams show typical values of fCHP and tCHP as a function of CHP.
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45 40 35 30 25 20 15 10 5 0 0,33
fCHP [Hz]
0,47
0,68
1 CHP [F]
2,2
3,3
4,7
6,8
Figure 5-4
Corner frequency of high-pass filter as a function of CHP (typical values)
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180 160 140 120 100 80 60 40 20 0 0,33
tCHP [msec]
0,47
0,68
1 CHP [F]
2,2
3,3
4,7
6,8
Figure 5-5
Time constant of high-pass filter as a function of CHP (typical values)
Data Sheet
5-3
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PEB 2026 PEF 2026
Designing the External Components Capacitor CTP: The value of this capacitor defines the corner frequency and the resulting delay times tLIMON (Spec.-No.: 17) and tLIMOFF (Spec.-No.: 18), of the low-pass filter. For typical values of tLIMON and tLIMOFF as a function of CTP see the following diagrams.
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100 90 80 70 60 50 40 30 20 10 0 22 33 47 68 100 220 330 470 680 1000 CTP [nF]
Figure 5-6
tLIMON [msec]
Delay time of the low-pass filter for the status output signal (typical values)
*
100 90 80 70 60 50 40 30 20 10 0 22 33 47 68 100 220 330 470 680 1000 CTP [nF]
Figure 5-7
*
tLIMOFF [msec]
Delay time of the low-pass filter for the status output signal (typical values)
Data Sheet
5-4
09.99
PEB 2026 PEF 2026
Application Note
6
*
Application Note
Figure 6-1
Application Circuit
Data Sheet
6-1
09.99
PEB 2026 PEF 2026
Application Note
RREF
Defines the current-limit and the internal biasing currents. A smaller/bigger value increases/decreases the current limit. It will also effect power supply currents. Defines with an internal resistor the delay time (a typical value is 20 msec) from the low pass filter, whose output signal is called `APFI'. Short disturbances will therefore be filtered. A smaller/bigger value decreases/increases the delay time. Defines with an internal resistor the corner frequency from a high pass filter. It is used to make sure that longitudinal disturbances (AC) will not produce a current limiting effect. A smaller/bigger value decreases/increases the corner frequency. These resistors limit the peak currents during lightning transients. The maximum value for these resistors is defined by the allowed voltage drop on the resistors. The AC-signal-current will be shunted by this capacitor. A- and B-line to the subscriber The most negative supply voltage; also called battery voltage. This circuit makes sure that the voltage from RA to VBAT will not exceed the defined limits in case of lightning (see Absolute Maximum Ratings).
CTP
CHP
RLA, RLB
C
A, B
VBAT
overvoltage protection
Recommended Device Values:
RREF CTP CHP RLA, RLB
22 k,Current limiting is set to 50 mA 220 nF,`APFI' delay time is set to 20 msec 4.7 F,AC longitudinal disturbances in a frequency range higher than 16.666 Hz do not effect a current limiting. 23 ,Minimum value, so that peek currents don't exceed 16 A (using voltage peek = 1 kV from 40 source resistance) in case of lightning.
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Data Sheet
6-2
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Electrical Characteristics
7
Table 7-1 Parameter
Electrical Characteristics
Absolute Maximum Ratings Symbol Limit Values min. max. 0.5 6 0.5 1 150 - 0.3 - 0.3 - 0.3 - 0.3 - 0.3 - 0.3 - 0.5 -8 - 16 - 0.3 -1 -1 V V V V C V V V V V V V A A V A V kV Referred to GNDD Referred to GNDD Referred to GNDD Referred to GNDD Referred to GNDD Referred to GNDD Referred to GNDB Referred to GNDB Referred to GNDD - 150 - 0.5 - 0.5 -1 Unit Test Condition
Battery voltage
VDD supply voltage
Ground voltage difference Ground pulse voltage difference
VBAT VDD VGNDB - VGNDD
VGNDB - VGNDD Tj Junction temperature Voltages on logic inputs VPFEN, VPFENQ PFEN, PFENQ Voltages on REF VREF VCP Voltages on CP VCN Voltages on CN Voltages on CTP VCTP Voltages on logic output VAPFI
APFI RB voltage RB pulse current RB peak current RA voltages RA pulse current RA pulse voltage ESD-voltage, all pins
tmax = 1 msec
VDD + 0.3 VDD + 0.3 VDD + 0.3 VDD + 0.3 VDD + 0.3 VDD + 0.3
+ 0.5 8 16 150 1 170 1
VRB IRB (into
pin RB)
tmax = 1 msec
See figure 7-7 Referred to VBAT
IRB_peak VRA IRA (into
pin RA)
tmax = 1 msec tmax = 1 msec, Referred to VBAT
Human body model
VRA_pulse
Note: Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit.
Data Sheet
7-1
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PEB 2026 PEF 2026
Electrical Characteristics Table 7-2 Parameter Battery voltage Operating Range Symbol Limit Values min. max. - 30 5.25 0.3 V V V Referred to GNDB Referred to GNDD - 130 4.75 - 0.3 Unit Test Condition
VBAT VDD VGNDB - VGNDD
VDD supply voltage
Ground voltage difference
Ambient temperature TA PEB 2026 PEF 2026 TA Static Thermal Resistance Junction to ambient Junction to case Junction to ambient Junction to pins
0 -40
+70 +85
C C
Rth, jA Rth, jC Rth, jA Rth, jPins
55 4 65 15
K/W K/W K/W K/W
P-DSO-20-10 P-DSO-20-10 P-DSO-20-6 P-DSO-20-6
Note: In the operating range the functions given in the circuit description are fulfilled.
The power package P-DSO-20-10 has an exposed copper-heatspreader with a high thermal capacitance. For power feeding to ISDN-lines which are in a fault condition (e.g. short circuit) the maximum power dissipation on chip will become VBAT supply voltage times limiting current (e.g.: 100V * 50mA = 5W). It is necessary to try to feed the line for about 2 seconds under this condition (5W), then the feeding can be switched off but must be switched on again about 30 seconds later. In this application the thermal capacitance of the cooper-heatspreader helps to keep the maximum chip temperature below the thermal protection temperature level (165C). No extra heatsink is necessary. The small P-DSO-20-6 package is applicable if the device is mounted on a pcb having at least 900 mm copper area close to the device. The pcb serves as heat sink, heat flowing off through the pins, particularly the Vbat pins. With a mounting like this, the IHPC performs as follows: a current of 50 mA is supplied for 5 sec, while the device is shorted to Vbat=100V. At an ambient temperature of 70C the current pulse may be periodically repeated with a period of 32 sec.
Data Sheet
7-2
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Electrical Characteristics Electrical Parameters Typical values are defined at the following test conditions:
VDD=5V 1 %CHP=4.7F 10 %(6.3 V) VBAT=- 100V 1 %CTP=220nF 10 %(6.3 V) RLA=23 1 %TA=25 5 C RLB=23 1 %RLine= 0.1 % RREF=22k 1 %no heatsink
Min. and max. values are in force within the whole operating range.
Table 7-3 No.
Power-Supply Symbol Limit Values min. typ. Unit Test Condition max. Test Mode Fig.
Parameter
Supply Currents (IRB = IRA = 0) 1 2
VDD current VBAT current
IDD IBAT
0.57 0.13
0.9 0.25
mA mA
7-1 7-1
all all
Table 7-4 No.
DC-Characteristics Symbol Limit Values min. typ. Unit Test Condition max. Test Mode Fig.
Parameter
Maximal Line Currents 3 Line current
Ilimit,ON
45
50
55
mA
7-2
ON,
Status:
LIMON
4
Line current
Imax,OFF
0
10
A
7-2
OFF
Logic Input Levels on PFEN and PFENQ 5 6 7 H-input voltage L-input voltage Input current
VIH VIL Iinp
2 0.8 2 11 20
V V A 0.8 V < =
all all all
Vinp < = VDD
Data Sheet 7-3 09.99
PEB 2026 PEF 2026
Electrical Characteristics Table 7-4 No. DC-Characteristics (cont'd) Symbol Limit Values min. Logic Output Levels on APFI 8 9 H-output voltage typ. Unit Test Condition max. Test Mode Fig.
Parameter
VOH
VDD -
0.4 0.4
V V
ISource = ISink =
ON ON, OFF
100 A
L-output voltage VOL
100 A
Resistance from GNDB to RB 10 R: GNDB to RB RRB 3 5 7
IRB = 30 mA 7-3 5%
ON, OFF
ON-resistance from RA to VBAT 11 ON-R: RA to VBAT (TL-Ron included)
RRA
2.65
5
7.35
IRA = 30 mA 7-3
5%
ON,
Status:
LIMOFF
Difference-resistance between RRA and RRB 12
RRA - RRB
PEB 2026 PEF 2026
RDIFF
ON, - 0.35 0 - 0.40 0 0.35 0.40
Status:
LIMOFF
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Table 7-5
Indication of Current Limit Symbol Mode Test Condition Status Test Fig.
No. Parameter
Indication of Current Limit 13 14 Line Status Line Status
SLIMON SLIMOFF
ON ON
RLine = 1762 RLine = 2166
LIMON, APFI = VOL LIMOFF, APFI = VOH
7-4 7-4
Data Sheet
7-4
09.99
PEB 2026 PEF 2026
Electrical Characteristics Table 7-5 Indication of Current Limit (cont'd) Symbol Mode Test Condition Status Test Fig.
No. Parameter
Indication of Current Limit under Superimposed Longitudinal Current 15 16 Line Status Line Status
SLLIMON SLLIMOFF
ON ON
RLine = 1482 RLine = 2801
LIMON, APFI = VOL LIMOFF, APFI = VOH
7-5 7-5
Calculation and Values of RLine
V BAT 100V RLine = ------------- - RRA - RRB - RLA - RLB = ------------- - 5 - 5 - 23 - 23 I Line I L in e
where:
RLA, RLB ... referred to page 7-3, electrical parameters RRA, RRB ... referred to Spec.-No.: 10 and 11
ILine
35 mA 45 mA 55 mA 65 mA
RLine
2801 2166 1762 1482
Note: In some of these cases the IHPC will limit the line current to lower values.
Data Sheet
7-5
09.99
PEB 2026 PEF 2026
Electrical Characteristics
*.
Table 7-6
Timing-Characteristics Test Condition Tes Mod e t Fig.
No Paramete Symbol Limit Values Unit . r min typ. max . .
Delay from Begin/End of Current Limiting to Status LIMON/LIMOFF
17
Time to LIMON
tLIMON
10
20
30
msec RLine: 2166 -- 1762 ==> APFI: LIMOFF LIMON msec RLine: 1762 2166 ==> APFI: LIMON LIMOFF
7-6
ON
18
Time to LIMOFF
tLIMOFF
10
20
30
7-6
ON
*
Figure 7-1
Data Sheet
Power Dissipation and Reference Voltage Output
7-6 09.99
PEB 2026 PEF 2026
Electrical Characteristics
*
Figure 7-2
*
Maximal Line Currents
Figure 7-3
Resistances
Data Sheet
7-7
09.99
PEB 2026 PEF 2026
Electrical Characteristics
*
Figure 7-4
*
Line Status
Figure 7-5
Line Status under Superimposed Longitudinal Current
Data Sheet
7-8
09.99
PEB 2026 PEF 2026
Electrical Characteristics
*
Figure 7-6
Timing-Characteristics
Data Sheet
7-9
09.99
PEB 2026 PEF 2026
Electrical Characteristics
*
Figure 7-7
*
Lightning Voltage Influence
Data Sheet
7-10
09.99
PEB 2026 PEF 2026
Package Outlines
8
*
Package Outlines
P-DSO-20-6 (Plastic Dual Small Outline Package)
Sorts of Packing Package outlines for tubes, trays etc. are contained in our
SMD = Surface Mounted Device Data Sheet 8-1
Dimensions in mm
09.99
GPS05094
PEB 2026 PEF 2026
Package Outlines
*
P-DSO-20-10 (Plastic Dual Small Outline Package)
Sorts of Packing Package outlines for tubes, trays etc. are contained in our
SMD = Surface Mounted Device Data Sheet 8-2
Dimensions in mm
09.99
GPS05791

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